Component information
MFS2303BMBA0EP
NXP USA Inc. MFS2303BMBA0EP: Power Management - Specialized. Package / Case: 48-VFQFN Exposed Pad. Supplier Device Package: 48-HVQFN (7x7).
Product attributes
- Category
- Integrated Circuits (ICs); Power Management (PMIC); Power Management - Specialized
- Manufacturer
- NXP USA Inc.
- Part Status
- Active
- Grade
- Automotive
- Qualification
- AEC-Q100
- Applications
- System Basis Chip
- Mounting Type
- Surface Mount, Wettable Flank
- Package / Case
- 48-VFQFN Exposed Pad
- Supplier Device Package
- 48-HVQFN (7x7)
- Packaging
- Tray
Documentation and references
Documentation can be discussed with your inquiry.
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